Hitachi Chemical is a leading company of CeO₂ slurry for STI. "GPX" shows excellent polishing performance and it is suitable for finer patterens.

• for Metals

CMP Process

Advanced semiconductor devices with high performance are required to have multi-level layers, fine patterns to obtain high speed transmission. CMP process is indespensable to have well-planarized interlayer dielectric or metals in LSI and accomplish the above requirments.

Features

• Free form scratches by using tuned CeO₂ particles.
• High removal rate at low slurry content (CeO₂:1%).
• High planarization and selectivity between SiO₂ and Si₃N₄.
• Unnecessary for conventional etch back process.

Characteristics (Typical Values)

Item	Unit	HS-8005 series + HS-8102GP	HS-8005 series + HS-7303GP	HS-9000 series	SiO2 slurry
Features	–	High　planarization	Low　scratch	Good　workability	–
Supply form	–	2components	2components	1component	1component
Residual step height	nm	50	10	10	200
Automatic stop on Si3N4	–	Available	Available	Available	Unavailable