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Die Bonding Paste <EPINAL> for Lead Frame

Image of for Lead Frame

"EPINAL" has been used as a die bonding adhesive for semiconductor devices. We have a top-level market share in die bonding paste.

Features

  • Excellent workability to eliminate any problems of bonding layer.
  • Fast curability for high productivity.
  • Low stress for low warpage and high reliability.
  • High thermal conductivity.

Process

SWF

Characteristics (Typical Values)

Item Unit EN-4270K2 EN-4600B EN-4900F-1 EN-4900GC EN-4620K Test method
Features High modulus
Small chip
Low warpage
Cu L/F
Low modulus
Large chip
Low warpage
PPF
High thermal
conductive
Resin type Epoxy Epoxy Acrylate Acrylate Epoxy
Curing method Heat block Oven Heat block Heat block Oven
Viscosity 0.5rpm Pa∙s 70 56 100 60 113 EHD 3°Cone
5.0rpm Pa∙s 11 11 20 12 20
Die shear strength 25°C N / chip >59 >59 59 >59 45 2x2mm chip
250°C N / chip 16 11 12 17 27
Tensile modulus MPa 4,900 3,500 350 2,800 4,800 Tensilon
Thermal conductivity W / m∙K 0.8 1.5 2.0 2.0 10
*
2x2 Si chip

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