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Die Bonding Paste <EPINAL> for Substrate

Image of for Substrate

"EPINAL" has an excellent adhesion to various materials. The adhesiveness is controllable for different chip sizes and die bonding condition. It is available for Pb-free reflow.

Features

  • Excellent workability to eliminate any problems of bonding layer.
  • Fast curability for high productivity.
  • Low stress for low warpage and high reliability.

Process

SWF

Characteristics (Typical Values)

Item Unit EN-4900 EN-4900F-1 EN-4900GC Test method
Features Low warpage
Large chip
Low modulus
Large chip
Low warpage
Small chip
Resin type Acrylate Acrylate Acrylate
Curing method Heat block Heat block Heat block
Viscosity 0.5rpm Pa∙s 78 100 60 EHD 3°Cone
5.0rpm Pa∙s 15 20 12
Die shear strength 25°C N / chip 37 59 >59 2x2mm chip
250°C N / chip 14 12 17
Tensile modulus MPa 500 350 2,800 Tensilon
Thermal conductivity W / m∙K 1.6 2.0 2.0

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