"EPINAL" has an excellent adhesion to various materials. The adhesiveness is controllable for different chip sizes and die bonding condition. It is available for Pb-free reflow.

• for Lead Frame

Features

• Excellent workability to eliminate any problems of bonding layer.
• Fast curability for high productivity.
• Low stress for low warpage and high reliability.

Process

Characteristics (Typical Values)

Item		Unit	EN-4900	EN-4900F-1	EN-4900GC	Test method
Features		–	Low warpage Large chip	Low modulus Large chip	Low warpage Small chip	–
Resin type		–	Acrylate	Acrylate	Acrylate	–
Curing method		–	Heat block	Heat block	Heat block	–
Viscosity	0.5rpm	Pa∙s	78	100	60	EHD 3°Cone
	5.0rpm	Pa∙s	15	20	12
Die shear strength	25°C	N / chip	37	59	>59	2x2mm chip
	250°C	N / chip	14	12	17
Tensile modulus		MPa	500	350	2,800	Tensilon
Thermal conductivity		W / m∙K	1.6	2.0	2.0	–