DF, HS series are die bonding films, necessary for high performance packages such as stacked MCP and BGA. The uniform die bonding layer can be obtained by a simple laminating process.
Features of DF Series
Obtainable a uniform bonding layer without void.
Excellent workability and storage stability.
Excellent reflow crack resistance.
Application
Features of HS Series
Excellent stress reduction by low elastic modulus.
Excellent gap filling capability of substrate.
Applicable for thicker film.
Application
Characteristics (Typical Values)
Item
Unit
DF-335-7
DF-402
DF-470
HS-270
Test method
Thickness
μm
25
15, 25, 40
15, 25, 40
12.5, 25, 50, 75, 100
–
Die bonding condition
Temp.
°C
230
180
150
120~160
–
Load
MPa
0.04
0.04
0.04
0.04
–
Tensile modulus (25°C)
MPa
2,600
2,400
2,400
1,000
DMA
Tg
°C
123
68
76
180
TMA
Die shear strength (260°C)
N/chip
>100
>100
>100
>100
5x5mm chip
Process
Wafer backside lamination
Cut and lamination
