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Die Bonding Film <HIATTACH>DF, HS Series

Image of DF, HS Series

DF, HS series are die bonding films, necessary for high performance packages such as stacked MCP and BGA. The uniform die bonding layer can be obtained by a simple laminating process.

Features of DF Series

Application

  • Obtainable a uniform bonding layer without void.
  • Excellent workability and storage stability.
  • Excellent reflow crack resistance.

Features of HS Series

Application

  • Excellent stress reduction by low elastic modulus.
  • Excellent gap filling capability of substrate.
  • Applicable for thicker film.

Characteristics (Typical Values)

Item Unit DF-335-7 DF-402 DF-470 HS-270 Test method
Thickness μm 25 15, 25, 40 15, 25, 40 12.5, 25, 50, 75, 100
Die bonding condition Temp. °C 230 180 150 120~160
Load MPa 0.04 0.04 0.04 0.04
Tensile modulus (25°C) MPa 2,600 2,400 2,400 1,000 DMA
Tg °C 123 68 76 180 TMA
Die shear strength (260°C) N/chip >100 >100 >100 >100 5x5mm chip

Process

SWF

Wafer backside lamination

SWF

Cut and lamination

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