Electronics Related Products >> Semiconductor Related Materials
Die Bonding Film <HIATTACH>
DF, HS SeriesInquiry
- DF, HS series are die bonding films, necessary for high performance packages such as stacked MCP and BGA. The uniform die bonding layer can be obtained by a simple laminating process.
Features of DF Series
- Obtainable a uniform bonding layer without void.
- Excellent workability and storage stability.
- Excellent reflow crack resistance.
Application
Features of HS Series
- Excellent stress reduction by low elastic modulus.
- Excellent gap filling capability of substrate.
- Applicable for thicker film.
Application
Characteristics (Typical Values)
| Item | Unit | DF-335-7 | DF-402 | DF-470 | HS-270 | Test method | |
|---|---|---|---|---|---|---|---|
| Thickness | μm | 25 | 15, 25, 40 | 15, 25, 40 | 12.5, 25, 50, 75, 100 | – | |
| Die bonding condition | Temp. | °C | 230 | 180 | 150 | 120~160 | – |
| Load | MPa | 0.04 | 0.04 | 0.04 | 0.04 | – | |
| Tensile modulus (25°C) | MPa | 2,600 | 2,400 | 2,400 | 1,000 | DMA | |
| Tg | °C | 123 | 68 | 76 | 180 | TMA | |
| Die shear strength (260°C) | N/chip | >100 | >100 | >100 | >100 | 5x5mm chip | |
Process
Wafer backside lamination
Cut and lamination