Die Bonding Film <HIATTACH>Dicing Die Bonding Film FH Series
FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at one time, it has achieved easy handling of thinner wafers.
FH series is a co-developed product with The Furukawa Electric Co., Ltd.
- Excellent dicing and pick-up performance.
- Low lamination temperature to a wafer.
- Excellent wire bondability without film curing.
- Excellent reflow crack resistance.
Characteristics (Typical Values)
|Adhesive Thickness||μm||10, 20, 25, 40||10, 20, 25, 40||–|
|Adhesive strength between
DCT and DBF
|Wafer laminating temp.||°C||60~90||60~80||–|
|Die bonding condition||Temp.||°C||100~160||100~160||–|
|Elastic modulus (35°C)||MPa||200||200||DMA|
|Die shear strength (260°C)||N/chip||>100||>100||5x5mm chip|