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Die Bonding Film <HIATTACH>Dicing Die Bonding Film FH Series

Image of Dicing Die Bonding Film FH Series

FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at one time, it has achieved easy handling of thinner wafers.

FH series is a co-developed product with The Furukawa Electric Co., Ltd.


  • Excellent dicing and pick-up performance.
  • Low lamination temperature to a wafer.
  • Excellent wire bondability without film curing.
  • Excellent reflow crack resistance.

Characteristics (Typical Values)

Item Unit FH-900 FH-9011 Test method
Adhesive Thickness μm 10, 20, 25, 40 10, 20, 25, 40
DC tape
Exposure doze mJ/cm2 150~400 150~400
Adhesive strength between
Before UV N/25mm 1.4 1.4
After UV N/25mm <0.1 <0.1
Wafer laminating temp. °C 60~90 60~80
Die bonding condition Temp. °C 100~160 100~160
Load MPa 0.05~2.0 0.05~2.0
Elastic modulus (35°C) MPa 200 200 DMA
Tg °C 180 180 TMA
Die shear strength (260°C) N/chip >100 >100 5x5mm chip



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