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Die Bonding Film <HIATTACH>
Dicing Die Bonding Film FH Series Inquiry
FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at one time, it has achieved easy handling of thinner wafers.
FH series is a co-developed product with The Furukawa Electric Co., Ltd.
Features
Excellent dicing and pick-up performance.
Low lamination temperature to a wafer.
Excellent wire bondability without film curing.
Excellent reflow crack resistance.
Characteristics (Typical Values)
Item
Unit
FH-800
FH-900
FH-9011
Test method
Adhesive Thickness
μm
10, 20
10, 20, 25, 40
10, 20, 25, 40
DC tape
properties
Exposure doze
mJ/cm2
150~400
150~400
150~400
Adhesive strength between
DCT and DBF
Before UV
N/25mm
1.4
1.4
1.4
After UV
N/25mm
<0.1
<0.1
<0.1
Wafer laminating temp.
°C
60~90
60~90
60~80
Die bonding condition
Temp.
°C
100~160
100~160
100~160
Load
MPa
0.05~2.0
0.05~2.0
0.05~2.0
Elastic modulus (35°C)
MPa
280
200
200
DMA
Tg
°C
165
180
180
TMA
Die shear strength (260°C)
N/chip
>100
>100
>100
5x5mm chip
Process