FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at one time, it has achieved easy handling of thinner wafers.

FH series is a co-developed product with The Furukawa Electric Co., Ltd.

• DF, HS Series
• Underfill Film

Features

• Excellent dicing and pick-up performance.
• Low lamination temperature to a wafer.
• Excellent wire bondability without film curing.
• Excellent reflow crack resistance.

Characteristics (Typical Values)

Item			Unit	FH-800	FH-900	FH-9011	Test method
Adhesive Thickness			μm	10, 20	10, 20, 25, 40	10, 20, 25, 40	–
DC tape properties	Exposure doze		mJ/cm2	150~400	150~400	150~400	–
	Adhesive strength between DCT and DBF	Before UV	N/25mm	1.4	1.4	1.4	–
		After UV	N/25mm	<0.1	<0.1	<0.1	–
Wafer laminating temp.			°C	60~90	60~90	60~80	–
Die bonding condition	Temp.		°C	100~160	100~160	100~160	–
	Load		MPa	0.05~2.0	0.05~2.0	0.05~2.0	–
Elastic modulus (35°C)			MPa	280	200	200	DMA
Tg			°C	165	180	180	TMA
Die shear strength (260°C)			N/chip	>100	>100	>100	5x5mm chip

Process