Die Bonding Film <HIATTACH>

UF series has achieved flip chip interconnection only by applying heat and pressure without conventional liquid underfilling. Two types are avalable: one with and one without conductive particles. It can be available for various connection methods.

• DF, HS Series
• Dicing Die Bonding Film

Features

• Realizable fine pitch interconnection only with the application of heat and pressure.
• Unnecessary for underfill.
• Stress reduction between a chip and a substrate.
• 2 types are available: one with and one without conductive particles.

Structure

Characteristics (Typical Values)

Process