Die Bonding Film <HIATTACH>

Underfill Film UF SeriesProduct Inquiry
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UF series has achieved flip chip interconnection only by applying heat and pressure without conventional liquid underfilling. Two types are avalable: one with and one without conductive particles. It can be available for various connection methods.

Features

  • Realizable fine pitch interconnection only with the application of heat and pressure.
  • Unnecessary for underfill.
  • Stress reduction between a chip and a substrate.
  • 2 types are available: one with and one without conductive particles.

Structure

Characteristics (Typical Values)

Item Unit FC-212K UF-536 Test method
Conductive particles – Included None –
Die bonding
condition		 Temp. °C 180 180 –
Load MPa 1 1 –
Time s 20 20 –
Elastic modulus (40°C) GPa 6.6 6.6 DMA
Tg °C 172 172 DMA

Process

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