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Die Bonding Film <HIATTACH>
Underfill Film UF Series
Inquiry
UF series has achieved flip chip interconnection only by applying heat and pressure without conventional liquid underfilling. Two types are avalable: one with and one without conductive particles. It can be available for various connection methods.
DF, HS Series
Dicing Die Bonding Film
Features
Realizable fine pitch interconnection only with the application of heat and pressure.
Unnecessary for underfill.
Stress reduction between a chip and a substrate.
2 types are available: one with and one without conductive particles.
Structure
Characteristics (Typical Values)
Item
Unit
FC-212K
UF-536
Test method
Conductive particles
Included
None
Die bonding
condition
Temp.
°C
180
180
Load
MPa
1
1
Time
s
20
20
Elastic modulus (40°C)
GPa
6.6
6.6
DMA
Tg
°C
172
172
DMA
Process