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Epoxy Molding Compounds <CEL>for Lead Frame

Image of for Lead Frame

Hitachi Chemical has a top-level market share in epoxy molding compounds. Our products meet the customers' demands and the changes of package trends.

Features

  • Excellent moisture resistance and heat shock resistance.
  • Excellent reflow crack resistance.

<Applications>

DIP, SOP, TSOP, QFP, TQFP, LQFP and etc.

Process

SWF

Characteristics (Typical Values)

Item Unit CEL-8240
HF10HD
CEL-9200
HF10
CEL-9240
HF10
CEL-9240
ZHF10HT3W
CEL-9200
HF9
Applications - QFP,SOP,TSOP QFP,SOP,QFN,PLCC QFN
Flame retardant type - No flame
 retardant
No flame
 retardant
No flame
 retardant
No flame
 retardant
Organic
phosphorous
Spiral flow cm 120 100 100 140 110
Tg °C 110 125 110 125 110
CTE α1 ppm/°C 8 8 7 12 8
α2 ppm/°C 35 33 28 38 32
Flexural modulus GPa 25 27 33 30 27
Mold shrinkage % 0.17 0.17 0.16 0.15 0.22
Thermal conductivity W/mK - - - 3 -

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