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Epoxy Molding Compounds <CEL>for Lead Frame

Image of for Lead Frame

Hitachi Chemical has a top-level market share in epoxy molding compounds. Our products meet the customers' demands and the changes of package trends.

Features

  • Excellent moisture resistance and heat shock resistance.
  • Excellent reflow crack resistance.

<Applications>

DIP, SOP, TSOP, QFP, TQFP, LQFP and etc.

Process

SWF

Characteristics (Typical Values)

Item Unit CEL-1620
HF16
CEL-1620
HF17
CEL-9200
HF10
CEL-9240
HF10
CEL-9200
HF9
Applications DIP DIP QFP, SOP, QFN, PLCC QFN
Flame retardant type Metal
hydroxide
Metal
hydroxide
No flame
retardant
No flame
retardant
Organic
phosphorous
Spiral flow cm 120 80 100 100 110
Tg °C 155 150 125 110 110
CTE α1 ppm/°C 19 19 8 7 8
α2 ppm/°C 64 64 33 28 32
Flexural modulus GPa 16 14 27 33 27
Mold shrinkage % 0.45 0.55 0.17 0.16 0.22

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