Electronics Related Products >> Semiconductor Related Materials
Epoxy Molding Compounds <CEL>
for Lead FrameInquiry
- Hitachi Chemical has a top-level market share in epoxy molding compounds. Our products meet the customers' demands and the changes of package trends.
Features
- Excellent moisture resistance and heat shock resistance.
- Excellent reflow crack resistance.
<Applications>
DIP, SOP, TSOP, QFP, TQFP, LQFP and etc.
Process
Characteristics (Typical Values)
| Item | Unit | CEL-1620 HF16 |
CEL-1620 HF17 |
CEL-9200 HF10 |
CEL-9240 HF10 |
CEL-9200 HF9 |
|
|---|---|---|---|---|---|---|---|
| Applications | – | DIP | DIP | QFP, SOP, QFN, PLCC | QFN | ||
| Flame retardant type | – | Metal hydroxide |
Metal hydroxide |
No flame retardant |
No flame retardant |
Organic phosphorous |
|
| Spiral flow | cm | 120 | 80 | 100 | 100 | 110 | |
| Tg | °C | 155 | 150 | 125 | 110 | 110 | |
| CTE | α1 | ppm/°C | 19 | 19 | 8 | 7 | 8 |
| α2 | ppm/°C | 64 | 64 | 33 | 28 | 32 | |
| Flexural modulus | GPa | 16 | 14 | 27 | 33 | 27 | |
| Mold shrinkage | % | 0.45 | 0.55 | 0.17 | 0.16 | 0.22 | |