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Epoxy Molding Compounds <CEL>for Substrate

Image of for Substrate

This type is suitable for BGA and CSP, and has low warpage and excellent reflow crack resistance. It is also applicable for packages with narrow pad pitch and long wire.

Features

  • Small warpage after molding.
  • Excellent reflow crack resistance.
  • Applicability to mold underfilling process.

<Applications>

CSP, BGA, Stacked MCP and etc.

Process

SWF

Characteristics (Typical Values)

Item Unit CEL-
1702
HF13
CEL-
1802
HF19
CEL-
9700
HF10
CEL-
9750
HF10
CEL-
9750
ZHF10
HT3W
CEL-
9750
ZHF10
GE-
100
GE-
110
Applications - BOC BOC BGA,CSP
Flame retardant type - Metal
 hydrox-ide
Organic
phos-phorous
No flame
 retardant
No flame
 retardant
No flame
 retardant
No flame
 retardant
Metal
 hydrox-ide
Metal
 hydrox-ide
Spiral flow cm 90 90 110 145 185 150 190 165
Tg °C 125 120 125 140 145 150 145 155
CTE α1 ppm/
°C
12 9 6 7 12 7 9 9
α2 ppm/
°C
45 36 27 29 41 27 38 35
Flexural modulus GPa 16 17 27 27 27 26 23 22
Mold shrinkage % 0.32 0.35 0.1 0.1 0.18 0.08 0.1 0.08
Thermal conductivity W/mK - - - - 3 - - -

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