Liquid Encapsulants
 - Hitachi Chemical develops various types of liquid encapsulants along with cutting-edge packaging trend, TCP, COF, FCBGA, wafer level CSP and so on.
Features
- Excellent moisture resistance & electrical properties.
- Excellent adhesion to the various types of substrates.
- Low ionic impurities.
- Minimum warpage by low CTE.
Features and Characteristics (Typical Values)
| Applications |
Products |
Features |
Curing Conditions
(°C/h) |
| TCP |
 |
CEL-C-5020 |
It shows excellent film formability and voltage resistance. |
120°C/20min+
150°C/2h |
COF
(Underfill) |
 |
CEL-C-3900 |
It is a non-filler type material, excellent impregnation and migration resistance. |
120°C/15min+
150°C/1h |
FC-BGA
(Underfill) |
 |
CEL-C-3720 |
It shows excellent adhesion in humidity and excellent reflow resistance and thermal cycling resistance by making the CTE meet that of solder bmp. |
165°C/2h |
| WL-CSP |
 |
CEL-C-7700 |
It enables to reduce wafer warpage due to low CTE. |
130°C/1h+
180°C/3h |
 |