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High Heat Resistant Coating Materials <HIMAL>HL Series, HP Series

Image of HL Series, HP Series

HL series is a high heat resistant coating material which forms high reliable film simply by drying the solvent at below 200°C. This film is suitable for various electronic parts and semiconductor devices by excellent flexibility, toughness and low warpage. In addition, HL Series can be used to improve adhesion between molding compounds and substrate, for improving reliability.

Features

  • High heat resistance.
  • Excellent solvent, acid and alkaline resistance.
  • Film formation at low temperature.
  • Excellent stress reduction.
  • Excellent in improving adhesion between molding compounds and substrate.
  • Excellent insulation performance.

Applications

SWF

Usage example: Junciton coating resin

Image of Usage example

Usage example: Insulating layer,
Preventing delamination coating

  • Junction coating resin for power devices.
  • Passivation for semiconductor devices.
  • Improvement of adhesion between molding compounds and substrate, use for preventing delamination.
  • Suppression of leakage current by formation of insulating layer to semiconductor device.

Characteristics (Typical Values)

Item Unit HL-1210 HP-1000
Use Spin coating
Dipping
Spray coating
Potting
Dispensing
Printing
Liquid
properties
Solid content % 15 22
Viscosity Pa∙s 0.2 120
Resin
properties
Tg °C 220 210
Decomposition temp. °C 410 410
CTE ppm/°C 60 55
Elastic modulus GPa 2.0 2.8
Break down Voltage V/μm 230 230

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