HL series is a high heat resistant coating material which forms high reliable film simply by drying the solvent at below 200ºC. This film is suitable for various electronic parts and semiconductor devices by excellent flexibility, toughness and low warpage.

• for Screen Printing

Features

• High heat resistance.
• Excellent solvent, acid and alkaline reisitance.
• Film formation at low temperature.
• Excellent stress reduction.

Applications

• Junction coating resin for power devices.
• Passivation for semiconductor devices.

Characteristics (Typical Values)

Item		Unit	HL-1200	HL-1450
Features		–	High heat reisitance	Low modulus
Liquid properties	Solid content	%	12	4.8
	Viscosity	Pa∙s	0.5	1.1
Resin properties	Tg	°C	225	180
	Decomposition temp.	°C	400	390
	CTE	ppm/°C	50	100
	Elastic modulus	MPa	2,600	680