RT series is a supporting tape used in the map molding process of QFN and SON. Attaching on the reverse face of a lead frame, it has achieved no flush burr after molding and high productivity in wire bonding. The applications has been expanded to new packages besides QFN and SON.
Packaging process using RT series (map molding type)
Features
Thermoplastic resin with high thermal stability for adhesive layer.
Good wire bondability.
No flash burr after molding.
No Adhesive on a lead frame after detaping.
Low adhesiveness of the tape at room temperature achieves no dust attachment.
Characteristics (Typical Values)
Item
Unit
RT-321
RT-321-CD1
Features
–
Standard
Higher adhesion for Ni/Pd/Au
Bonding temp.
°C
200~250
190~250
Detaping temp.*
°C
25~200
25~200
Tg
°C
220
190
Flash burr after molding
–
None
None
Residue after detaping
–
None
None
Adhesive strength to Ni/Pd/Au
N/m
50
100
* Heating is required for some lead frames and epoxy molding compounds.
