Electronics Related Products >> Semiconductor Related Materials
Map Molding Support Tape
RT SeriesInquiry
- RT series is a supporting tape used in the map molding process of QFN and SON. Attaching on the reverse face of a lead frame, it has achieved no flush burr after molding and high productivity in wire bonding. The applications has been expanded to new packages besides QFN and SON.
Packaging process using RT series (map molding type)
Features
- Thermoplastic resin with high thermal stability for adhesive layer.
- Good wire bondability.
- No flash burr after molding.
- No Adhesive on a lead frame after detaping.
- Low adhesiveness of the tape at room temperature achieves no dust attachment.
Characteristics (Typical Values)
| Item | Unit | RT-321 | RT-521 |
|---|---|---|---|
| Features | – | Standard | Cu L/F |
| Bonding temp. | °C | 200~250 | 200~250 |
| Detaping temp.* | °C | 25~200 | 25 |
| Flash burr after molding | – | None | None |
| Residue after detaping | – | None | None |
* Heating is required for some lead frames and epoxy molding compounds.