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Cleaning Sheet for Semiconductor Encapsulation Molding DieN-CS Series

Image of N-CS Series

N-CS series is sheet type cleaning materials which removes stains from molding die for semiconductor encapsulation. With higher cleaning performance, it can reduce the time to clean-up molding die, compared with conventional cleaning compounds.

Features

  • N-CS series can reduce the time to clean-up molding die.
  • N-CS provides good solution for burrs on surface of molding die, stains from gas and blocking of air vent.
  • As N-CS series are environment safety materials, there is less noxious fumes, contamination and corrosion of molding die after cleaning.

How to Use

Image of How to Use

(1)Put the sheet on the molding die.

(2)Compress and mold.

(3)Open the die and remove the sheet.

Line-up

Item Cleaning sheet Wax sheet
N-CS-2000 N-CS-5710 N-CS-7000 series N-CS-3300
Application Conventional EMC
Green compounds - -
Clear compounds - - -
Features Cleaning + Recovery of releasability Low temp. cleaning Good cleaning performance + Easy to peel off from die Applicable for all compounds

Cleaning Performance

Graph of Cleaning Performance

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Tentative data after 300 shot of continuous molding with our green compounds

N-CS W type -High filling performance for small-sized cavity-

  • N-CS W type completely fills cavity of mold die without air gap.
  • N-CS W type is suitable for molding die with small cavity for small-sized semiconductor, diodes and mini transistor.
  • N-CS W type is designed in a way that cavity is not blocked when the sheet is set on the mold die at any position.
  • With N-CS W type, the air inside cavity can completely escape to outside and can remove off stains from the entire cavity.

Image of N-CS W type -High filling performance for small-sized cavity-

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