Semiconductor Related Materials

Interlayer Dielectric Materials

HSGDetailsProduct Inquiry
Image of Interlayer Dielectric Materials
"HSG" is a new spin-on material (SOG) which is effective on high-speed devices with ULSI multilevel interconnections. It provides excellent properties: high mechanical strength and low water absorption.

CMP Slurry <GPX>

for STIDetailsProduct Inquiry
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Hitachi Chemical is a leading company of CeO2 slurry for STI. "GPX" shows excellent polishing performance and it is suitable for finer patterens.

CMP Slurry <GPX>

for MetalsDetailsProduct Inquiry
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"GPX" has two types: HS-C series for Cu and HS-T series for barrier metals. The polishing performance is controllable for various processes and devices.

High Heat Resistance Fine Polyimides for VLSI

PIQ, PIX, PI, PL, HD SeriesProduct Inquiry
Image of High Heat Resistance Fine Polyimides for VLSI
Non photosensitive polyimide (PIQ, PIX, PI series) can be patterned using a lithographic process in conjunction with liquid photoresist. Photosensitive polyimide (PL, HD, PI series) is light-sensitive and readily patterned without the use of photoresist, further simplifying the fabrication processes with solvent and aqueous developers. They are applicable for 300mm wafer and wafer level CSP.
PIQ, PIX, PI, PL, HD series are manufactured and marketed by HD MicroSystems. Click on the link below.

Die Bonding Paste <EPINAL>

for Lead FrameDetailsProduct Inquiry
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"EPINAL" has been used as die bonding adhesive for semiconductor devices. We have a top-level market share in die bonding paste.

Die Bonding Paste <EPINAL>

for SubstrateDetailsProduct Inquiry
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"EPINAL" has an excellent adhesion to various materials. The adhesiveness is controllable for different chip sizes and die bonding conditions and available for Pb-free reflow.

Die Bonding Film <HIATTACH>

DF, HS SeriesDetailsProduct Inquiry
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DF and HS series are die bonding films, necessary for high performance packages such as Stacked MCP and BGA. The uniform die bonding layer can be obtained by a simple laminating process.

Die Bonding Film <HIATTACH>

Dicing Die Bonding Film FH SeriesDetailsProduct Inquiry
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FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at a time, it achieves easy handling of thinner wafer.

FH series is a co-developed product with
The Furukawa Electric Co.,Ltd.

Die Bonding Film <HIATTACH>

Underfill Film UF SeriesDetailsProduct Inquiry
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UF series has achieved flip chip interconnection only by applying heat and pressure without conventional liquid underfilling. Two types are available: with and without conductive particles. It can be available for various connection methods.

Epoxy Molding Compounds <CEL>

for Lead FrameDetailsProduct Inquiry
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Hitachi Chemical has a top-level market share in epoxy molding compounds. Our products meet the customers' demands and the changes of package trends.

Epoxy Molding Compounds <CEL>

for SubstrateDetailsProduct Inquiry
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This type is suitable for BGA and CSP, and has low warpage and excellent reflow crack resistance. It is also applicable for packages with narrow pad pitch and long wire.

Liquid Encapsulants

CEL-C SeriesDetailsProduct Inquiry
Image of Liquid Encapsulants
Hitachi Chemical develops various types of liquid encapsulants along the cutting-edge package trend: TCP, COF, FCBGA, wafer level CSP and so on.

High Heat Resistant Coating Materials <HIMAL>

HL SeriesDetailsProduct Inquiry
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HL series is a high heat resistant coating material which forms high reliable film simply by drying the solvent at below 200°C. The film is suitable for various electronic parts and semiconductor devices by excellent flexibility, toughness and low warpage.

High Heat Resistant Coating Materials <HIMAL>

for Screen Printing HP SeriesDetailsProduct Inquiry
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HP series is a high heat resistant paste with screen printable capability. It is used as junction coating resin for power devices and compliant layer for wafer level CSP. It is also suitable for non-contact high accuracy dispensing.

LOC Tape

HM SeriesDetailsProduct Inquiry
Image of LOC Tape
HM series is die bonding tape for LOC packages. It contains a high heat resistant thermoplastic resin in the adhesive, widely known as an overcoating material for semiconductors. It shows excellent stability and easy handling capability.

Map Molding Support Tape

RT SeriesDetailsProduct Inquiry
Image of Map Molding Support Tape
RT series is used in the map molding process of semiconductor packages such as QFN and SON. Attaching on the reverse face of a lead frame, RT series has achieved no flush burr after molding and high productivity in wire bonding. The applications have been expanded to new packages besides QFN and SON.

Release Sheet RM-4000 Series

DetailsProduct Inquiry
Image of Release Sheet RM-4100
RM-4100 reduces the flash burr in molding QFN etc. package.
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