Semiconductor Related Materials
 - "HSG" is a new spin-on material (SOG) which is effective on high-speed devices with ULSI multilevel interconnections. It provides excellent properties: high mechanical strength and low water absorption.
 - Hitachi Chemical is a leading company of CeO2 slurry for STI. "GPX" shows excellent polishing performance and it is suitable for finer patterens.
 - "GPX" has two types: HS-C series for Cu and HS-T series for barrier metals. The polishing performance is controllable for various processes and devices.
 - Non photosensitive polyimide (PIQ, PIX, PI series) can be patterned using a lithographic process in conjunction with liquid photoresist. Photosensitive polyimide (PL, HD, PI series) is light-sensitive and readily patterned without the use of photoresist, further simplifying the fabrication processes with solvent and aqueous developers. They are applicable for 300mm wafer and wafer level CSP.
PIQ, PIX, PI, PL, HD series are manufactured and marketed by HD MicroSystems.
 - "EPINAL" has been used as die bonding adhesive for semiconductor devices. We have a top-level market share in die bonding paste.
 - "EPINAL" has an excellent adhesion to various materials. The adhesiveness is controllable for different chip sizes and die bonding conditions and available for Pb-free reflow.
 - DF and HS series are die bonding films, necessary for high performance packages such as Stacked MCP and BGA. The uniform die bonding layer can be obtained by a simple laminating process.
 - FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at a time, it achieves easy handling of thinner wafer.
FH series is a co-developed product with
The Furukawa Electric Co.,Ltd.
 - UF series has achieved flip chip interconnection only by applying heat and pressure without conventional liquid underfilling. Two types are available: with and without conductive particles. It can be available for various connection methods.
 - Hitachi Chemical has a top-level market share in epoxy molding compounds. Our products meet the customers' demands and the changes of package trends.
 - This type is suitable for BGA and CSP, and has low warpage and excellent reflow crack resistance. It is also applicable for packages with narrow pad pitch and long wire.
 - Hitachi Chemical develops various types of liquid encapsulants along the cutting-edge package trend: TCP, COF, FCBGA, wafer level CSP and so on.
 - HL series is a high heat resistant coating material which forms high reliable film simply by drying the solvent at below 200°C. The film is suitable for various electronic parts and semiconductor devices by excellent flexibility, toughness and low warpage.
 - HP series is a high heat resistant paste with screen printable capability. It is used as junction coating resin for power devices and compliant layer for wafer level CSP. It is also suitable for non-contact high accuracy dispensing.
 - HM series is die bonding tape for LOC packages. It contains a high heat resistant thermoplastic resin in the adhesive, widely known as an overcoating material for semiconductors. It shows excellent stability and easy handling capability.
 - RT series is used in the map molding process of semiconductor packages such as QFN and SON. Attaching on the reverse face of a lead frame, RT series has achieved no flush burr after molding and high productivity in wire bonding. The applications have been expanded to new packages besides QFN and SON.
 - RM-4100 reduces the flash burr in molding QFN etc. package.
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